Daniel Armbrust
President and Chief Executive Officer
Daniel Armbrust was named President and Chief Executive Officer of SEMATECH in November, 2009 with the responsibility to lead the consortium’s advanced technology R&D programs in lithography, front end processes, interconnect, and metrology, and oversee SEMATECH’s subsidiary, the International SEMATECH Manufacturing Initiative (ISMI).
Armbrust previously spent 25 years at IBM Corporation, culminating in his tenure as Vice President of 300 mm Semiconductor Operations for the company’s Systems Technology Group where he was responsible for the operation of IBM’s 300 mm fab in East Fishkill, New York, which develops leading edge technologies with IBM’s alliance partners and manufactures products for IBM and OEM customers. His leadership was marked by successful efforts to improve operating efficiency, lead executive collaborations within the industry, and build strong technical teams.
Prior to his role as Vice President, Armbrust served as Director of 300 mm Engineering and Strategic Client Executive for IBM’s Systems and Technology Group. He began his career at IBM in 1983 and progressed through a variety of assignments in process development, manufacturing and client engagement.
Armbrust earned a bachelor’s degree in ceramic science and engineering from Pennsylvania State University as well as a Master of Science degree in manufacturing systems engineering from Rensselaer Polytechnic Institute.
Editors: A high-resolution image is available here.
