SEMATECH Dictionary of Semiconductor Terms

A-Am | An-Az | B | C-Ch | Ci-Com | Con-Cz | D-De | Df-Dz | E-En | Eo-Ez | F-Fl
Fm-Fz | G | H | I | J-K | L | M-Mes | Met-Mz | N | O | P-Ph | Pi-Pq | Pr-Pz | Q | R
S-Se | Sh-So | Sp-Sta | Ste-Sz | T-Th | Ti-Tz | U-V | W-Z

"Fm - Fz"

FMEA n		see failure mode and effects analysis.
foam n		a type of fire-fighting material consisting of small bubbles of air, water, and concentrating agents that extinguishes a fire by blanketing it and excluding air and the escape of volatile vapor. Flowing properties resist mechanical interruption and reseal the burning material. [SEMATECH]
focal plane n		the plane perpendicular to the optical axis of an imaging system that contains the focal point of the imaging system. [SEMI M1-94]
focal plane deviation (FPD) n		the distance parallel to the optical axis from a point on the wafer surface to the focal plane of the optical system. [SEMI M1-94 and ASTM F1241]
focal range n		in the measurement of photolithographic instruments, the total distance of defocus in which, over the whole of the processed image field, the processed image is sufficiently resolved for practical use. [SEMI P25-94]
focal surface n		in the measurement of photolithographic instruments, the surface determined by finding the focus for each point-like object in the optical image field, with the object fixed with respect to the lens. The focal surface is then the map of Z-axis displacements for the highest contrast at each point in the optical image field as a function of the (x,y) or (r,) coordinates. [SEMI P25-94]
focus n		in the measurement of photolithographic instruments, a condition of geometric adjustment of the lens' object, the optical system, and the image plane such that the optical image rays originating from a given point in the object converge to the smallest possible area at the corresponding point in the optical image. [SEMI P25-94] Also see focal surface.
focus n		in the measurement of photolithographic instruments, a condition of geometric adjustment of the lens' object, the optical system, and the image plane such that the optical image rays originating from a given point in the object converge to the smallest possible area at the corresponding point in the optical image. [SEMI P25-94] Also see focal surface.
focus n		in the measurement of photolithographic instruments, a condition of geometric adjustment of the lens' object, the optical system, and the image plane such that the optical image rays originating from a given point in the object converge to the smallest possible area at the corresponding point in the optical image. [SEMI P25-94] Also see focal surface.
Focus Technical Advisory Board (FTAB) n		technically skilled representatives of SEMATECH member companies responsible for review and advice on SEMATECH activities; formed by joint direction of the ETAB and external resources. [SEMATECH]
Food and Drug Administration (FDA) n		the federal agency that establishes requirements for the labeling of food and drugs to protect consumers. [SEMATECH]
forbidden energy gap n		the portion of the energy band structure of a semiconductor or insulator between the valence and conduction bands. This portion does not contain a continuum of states as do the valence and conduction bands but may contain discrete states introduced by dopant or deep level impurities in the material. [SEMATECH]
force n		for atomic force microscopy, interactions in the nanonewton scale leading to movement of the cantilever relative to the sample surface. [SEMATECH]
foreign material n		1 : an adherent particle that is not parent material of the component. Adherence means that the particle cannot be removed by an air or nitrogen blast at 20 psi. [SEMI G58-94] 2 : in flat panel display substrates, an opaque or partially melted particle of refractory or batch material embedded in glass. Its size is usually determined by the size of the distorted area. [SEMI D9-94] .
fork n		in cluster tools, a two-prong transport module end effector designed to hold the wafer around its periphery. [SEMI E22-91]
formal methods n		vigorous, discrete mathematical approach for the process of specifying, designing, and verifying circuits and systems. [1994 National Technology Roadmap for Semiconductors]
format n		1 : the general order in which information appears on the input medium. [SEMATECH] 2 : the arrangement of code characters within a group, such as a block or message, for data transmission. [SEMATECH]
formula weight n		the mass in grams per mole of a substance. [SEMATECH]
Fourier transform infrared spectroscopy (FTIR) n		a method of sample analysis in which incident infrared radiation is selectively absorbed by a sample according to the chemical bonds present in the sample. [SEMATECH]
four-point probe n		an electrical probe arrangement for determining the resistivity of a material, in which separate pairs of contacts are used (1) for passing current through the specimen and (2) for measuring the potential drop caused by the current. [SEMI M1-94 and ASTM F1241] Also called collinear four-probe array.
FPD n		see focal plane deviation.
FQA n		see fixed quality area.
FRACAS n		a closed-loop feedback path by which failures of both hardware and software data are collected, recorded, analyzed, and corrected. Abbreviation for failure reporting, analysis, and corrective action system. [SEMATECH]
fraction of good field n		see good field, fraction of.
fracture n		see crack.
fragmented bead n		in an ion-exchange resin, a piece of resin material that, when viewed at 20X magnification, appears to indicate that it would form a whole bead if reassembled with other fragmented pieces. [SEMATECH]
frame adhesive n		in the manufacture of photolithographic pellicles, adhesive between frame and photomask. [SEMI P5-94]
frame rail n		in metal leadframes, the edge strips of the frame that connect all the external lead tips that are perpendicular to the length of the leadframe strip and hold the individual frames in strip form. [SEMATECH]
framework n		a software system used to interconnect individual design tools, and one that that allows all of the design tools necessary to complete an integrated circuit design to be properly and effectively linked together. [1994 National Technology Roadmap for Semiconductors]
free-end closure n		1 : in determining hydraulic burst pressure of component specimens, a component (for example, cap or plug) used to allow the internal cavity of the specimen to be pressurized. Free-end closures do not contribute to the restraint of the specimen. [SEMATECH] 2 : in the pressure testing of fluorocarbon tube fittings, a metal tube fitting connection which is securely fastened to the tube and does not contribute to the restraint of the test specimen. [SEMI F10-93]
front end-of-line (FEOL) n		all processes from wafer start through final contact window processing. [SEMATECH]
front-to-back alignment n		in the manufacture of etched leadframes, the alignment, with respect to each other, of photomasks or image patterns after photomasking, on each side of the leadframe strip or sheet material. [SEMI G19-84]
front end n		see front-end of line.
front-end analysis n		an investigation into a problem to determine its cause and possible solution. [SEMATECH]
front plate n		in a panel that consists of two plates of glass, or substrates, bonded together, the plate nearest the viewer of the display. [SEMI D4-94]
front side n		see front surface.
front surface n		of a semiconductor wafer, the exposed surface on which active semiconductor devices either have been or will be fabricated. [SEMI M12-92 and ASTM F1241] Also called front side.
FTAB n		see Focus Technical Advisory Board.
FTIR n		see Fourier transform infrared spectroscopy.
full flow adj		refers to the complete process that makes a product. [SEMATECH] Contrast with short flow.
fume n		the solid particles generated by condensation from the gaseous state, generally after volatilization from melted substances and often accompanied by a chemical reaction such as oxidation. [ASTM D1356 REV A-73]
function n		in SECS communication, a specific message for a specific activity within a stream. [SEMI E5-92]
functional area n		in the leadframe of a semiconductor package, the portion that consists of the die attach pad and the lead tips to which the wires from the circuits on the die are attached. [SEMI G9-89]
functional pattern n		see pattern, functional.
functional probe n		the electronic testing of die on a wafer to determine conformance to specifications. [SEMATECH]
functional requirements n		a document that contains a detailed description of the functions to be performed by a computer program. [SEMATECH]
functional test n		one or more tests to determine whether a circuit's logic behavior is correct. [1994 National Technology Roadmap for Semiconductors]

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