3D Interconnects—Through Silicon Vias (TSVs)
EVG Gemini Wafer Bonder
The Gemini is a fully automated 300 mm wafer bonding tool. It also has modules for precision wafer-to-wafer alignment, surface activation, and wafer cleaning. It is a flexible tool capable of performing anodic, fusion, thermo-compression, adhesive, and eutectic wafer bonds. Wafer-to-wafer bonding is a key technology being developed at SEMATECH for 3D interconnects.
